Instrument Database:
Teledyne CETAC Technologies - LSX-500 Laser Ablation System
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Year of introduction |
2002 |
Status |
historical ( out of sale ) |
Company |
Teledyne CETAC Technologies
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Categories |
Sample introduction: Laser ablation |
The LSX-500 is the cutting edge of 266nm Laser Ablation performance. Utilizing a specially designed high energy 266 nm laser, the LSX-500 delivers exceptional performance at a competitive price. The LSX-500 is a versatile ablation system well suited to virtually any analytical environment. The LSX-500 not only offers greater performance than you would expect from a 266nm system, but does so with an unequalled degree of user safety and ease of use. Much debate exists as to the exact nature and origin of elemental fractionation during laser ablation (LA) processes. Wavelength, energy density and beam profile all have an influence on the accuracy of LA analyses. As an alternative to shorter wavelength lasers, a prototype high density 266 nm system with external beam homogenization was developed at ETH-Zurich. Based on this system, a commercial version with an internally homogenized beam was developed. The LSX-500 delivers a flat, uniform energy density across all spot sizes, sufficient to ablate difficult materials.
Features - > 9 mJ Laser Energy, 266 nm, < 6 ns pulse width
- Ablates "difficult" materials such as high purity fused silica, calcite and fluorite
- Uniform high density beam minimizes elemental fractionation seen in other 266 nm systems
- Uniform energy density across all spot sizes
- Improved optical viewing system for wider field of view and stable viewing
- Reliable, robust frequency quadrupled wavelength
- New and improved DigiLaz-II software
- High Resolution Translation Stage
- Large, Flexible Ablation Cell
DigiLazTMII Software The LSX-500 DigiLaz-II software was developed to bring the analyst an entirely new way of navigating the sample, creating methods, and performing sample analyses. DigiLaz-II software features include:
- Operation modes of either instant sample tracing mode or manual drawing mode
- Expanded laser methods for depth profile and segmented line scanning
- 5000 point capability for surface mapping and depth studies
- Image capture, annotation and export
- Service, maintenance tracking and help system
- Sample mapping feature allows imaging of the entire sampling area
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